Investigation on Mechanical Damage of No-Insulation REBCO Pancake Coil by Multi-Physics Quench Simulation

A no-insulation (NI) winding technique greatly improves the thermal stability of REBa 2 Cu xmlns:xlink="http://www.w3.org/1999/xlink">3 O xmlns:xlink="http://www.w3.org/1999/xlink">x (RE = Rare Earth; REBCO) pancake coils. Since it has recently been pointed out that strong electromagnetic forces due to induced currents cause mechanical damage NI REBCO coils during quench propagation under high magnetic field. The must be investigated and discussed further. We have developed a multi-physics simulation for by combining 2D stress/strain finite element analysis (FEA) with an field partial equivalent circuit (PEEC) method FEA. results showed consistency experimental results.